- Hersteller:
-
- Comair Rotron (1)
- Cooling Source (2)
- CUI Devices (2)
- t-Global Technology (15)
- Product Status:
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- Material:
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- Shape:
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- Length:
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- Attachment Method:
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- Package Cooled:
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- Fin Height:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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22 Aufzeichnungen
Bild | Teil | Hersteller | Beschreibung | MOQ | Aktie | Aktion | |
---|---|---|---|---|---|---|---|
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Cooling Source | 20X20X9.5MM WITH INT... |
1 |
1,234
In-stock
|
Erhalten Sie Zitat | ||
![]() |
t-Global Technology | CERAMIC HEAT SPR... |
1 |
207
In-stock
|
Erhalten Sie Zitat | ||
![]() |
t-Global Technology | CERAMIC HEAT SPR... |
1 |
182
In-stock
|
Erhalten Sie Zitat | ||
![]() |
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
1,500
In-stock
|
Erhalten Sie Zitat | ||
![]() |
t-Global Technology | ALUMINIUM HEAT S... |
1 |
137
In-stock
|
Erhalten Sie Zitat | ||
![]() |
t-Global Technology | CERAMIC HEAT SPR... |
1 |
100
In-stock
|
Erhalten Sie Zitat | ||
![]() |
t-Global Technology | CERAMIC HEAT SPR... |
1 |
80
In-stock
|
Erhalten Sie Zitat | ||
![]() |
t-Global Technology | ALUMINIUM HEAT S... |
1 |
140
In-stock
|
Erhalten Sie Zitat | ||
![]() |
t-Global Technology | ALUMINIUM HEAT S... |
1 |
125
In-stock
|
Erhalten Sie Zitat | ||
![]() |
t-Global Technology | ALUMINIUM HEAT S... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
![]() |
t-Global Technology | ALUMINIUM HEAT S... |
1 |
154
In-stock
|
Erhalten Sie Zitat | ||
![]() |
t-Global Technology | XL25 CERAMIC BOAR... |
1 |
1,845
In-stock
|
Erhalten Sie Zitat | ||
![]() |
Comair Rotron | HEATSINK STAMP 20... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
![]() |
t-Global Technology | ALUMINIUM HEAT S... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
![]() |
Advanced Thermal Solutions Inc. | HEATSINK TO-220 BL... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
![]() |
t-Global Technology | XL25 CERAMIC 20X20M... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
![]() |
t-Global Technology | XL25 CERAMIC 20X20M... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
![]() |
CUI Devices | HEATSINK TO-220 3.6W... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
![]() |
CUI Devices | HEAT SINK, BGA, 20 ... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
![]() |
Cooling Source | 20X20 9.5MM INTERFAC... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat |