- Hersteller：
-
- CUI Devices (5)
- Ohmite (1)
- Type：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
9 Aufzeichnungen
| Bild | Teil | Hersteller | Beschreibung | MOQ | Aktie | Aktion | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK CPU STA... |
1 |
3,653
In-stock
|
Erhalten Sie Zitat | ||
|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
2,619
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
1 |
1,935
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
1 |
44
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
Assmann WSW Components | HEATSINK CPU W/AD... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat |
