- Hersteller：
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- Comair Rotron (1)
- CUI Devices (3)
- Product Status：
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- Material：
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- Length：
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- Attachment Method：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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11 Aufzeichnungen
| Bild | Teil | Hersteller | Beschreibung | MOQ | Aktie | Aktion | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEAT SINK BLK ANO... |
1 |
5,180
In-stock
|
Erhalten Sie Zitat | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 W/T... |
1 |
103
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
439
In-stock
|
Erhalten Sie Zitat | ||
|
|
Assmann WSW Components | HEAT SINK BLK ANO... |
1 |
432
In-stock
|
Erhalten Sie Zitat | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 BL... |
1 |
352
In-stock
|
Erhalten Sie Zitat | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 AL... |
1 |
822
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEATSINK TO-220 4.1W... |
1 |
338
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEATSINK TO-220 4.1W... |
1 |
378
In-stock
|
Erhalten Sie Zitat | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat |
