- Hersteller：
-
- CUI Devices (11)
- WEC (3)
- Material：
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- Width：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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16 Aufzeichnungen
| Bild | Teil | Hersteller | Beschreibung | MOQ | Aktie | Aktion | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
1,492
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
710
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
610
In-stock
|
Erhalten Sie Zitat | ||
|
|
WEC | HEAT SINK, EXTRUS... |
1 |
568
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEATSINK TO-220 7.4W... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
WEC | HEAT SINK, EXTRUS... |
1 |
930
In-stock
|
Erhalten Sie Zitat | ||
|
|
WEC | HEAT SINK, EXTRUS... |
1 |
701
In-stock
|
Erhalten Sie Zitat | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEAT SINK |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat |
