- Hersteller：
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- CUI Devices (1)
- Ohmite (1)
- Product Status：
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- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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8 Aufzeichnungen
| Bild | Teil | Hersteller | Beschreibung | MOQ | Aktie | Aktion | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK ALUM AN... |
1 |
2,192
In-stock
|
Erhalten Sie Zitat | ||
|
|
Assmann WSW Components | HEATSINK CPU XCU... |
1 |
3,523
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
1 |
2,183
In-stock
|
Erhalten Sie Zitat | ||
|
|
t-Global Technology | CERAMIC HEAT SIN... |
1 |
426
In-stock
|
Erhalten Sie Zitat | ||
|
|
Ohmite | HEATSINK BLACK A... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
t-Global Technology | HEATSINK CER 12X12... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
t-Global Technology | HEATSINK CER 12X12... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
t-Global Technology | CERAMIC HEATSINK |
1 |
50,000
In-stock
|
Erhalten Sie Zitat |
