- Hersteller：
-
- CUI Devices (2)
- Wakefield-Vette (5)
- Product Status：
-
- Type：
-
- Width：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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14 Aufzeichnungen
| Bild | Teil | Hersteller | Beschreibung | MOQ | Aktie | Aktion | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | 1/2 BRICK HEATSINK... |
1 |
936
In-stock
|
Erhalten Sie Zitat | ||
|
|
Advanced Thermal Solutions Inc. | FULL BRICK HEATS... |
1 |
1,603
In-stock
|
Erhalten Sie Zitat | ||
|
|
Wakefield-Vette | HEATSINK DC/DC HA... |
1 |
4,814
In-stock
|
Erhalten Sie Zitat | ||
|
|
Wakefield-Vette | HEATSINK DC/DC HA... |
1 |
1,540
In-stock
|
Erhalten Sie Zitat | ||
|
|
Advanced Thermal Solutions Inc. | 1/2 BRICK HEATSINK... |
1 |
2,618
In-stock
|
Erhalten Sie Zitat | ||
|
|
Advanced Thermal Solutions Inc. | 1/2 BRICK HEATSINK... |
1 |
30
In-stock
|
Erhalten Sie Zitat | ||
|
|
Advanced Thermal Solutions Inc. | FULL BRICK HEATS... |
1 |
20
In-stock
|
Erhalten Sie Zitat | ||
|
|
Advanced Thermal Solutions Inc. | FULL BRICK HEATS... |
1 |
1
In-stock
|
Erhalten Sie Zitat | ||
|
|
Wakefield-Vette | HEATSINK BXB50,75,1... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
t-Global Technology | ALUMINIUM HEAT S... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
Wakefield-Vette | HEATSINK DC/DC HA... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
Wakefield-Vette | HEATSINK BXB50,75,1... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEATSINK HALF BR... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEATSINK HALF BR... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat |
