- Hersteller:
-
- Ohmite (4)
- Wakefield-Vette (5)
- Product Status:
-
- Material:
-
- Type:
-
- Attachment Method:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
10 Aufzeichnungen
Bild | Teil | Hersteller | Beschreibung | MOQ | Aktie | Aktion | |
---|---|---|---|---|---|---|---|
![]() |
Ohmite | HEATSINK D2PAK TO... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
![]() |
Wakefield-Vette | HEATSINK FOR 35MM... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
![]() |
Wakefield-Vette | HEATSINK FOR 35MM... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
![]() |
Wakefield-Vette | HEATSINK FOR 35MM... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
![]() |
Wakefield-Vette | HEATSINK FOR 35MM... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
![]() |
Wakefield-Vette | HEATSINK FOR 35MM... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
![]() |
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
![]() |
Ohmite | HEATSINK D2PAK TO... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
![]() |
Ohmite | HEATSINK D2PAK TO... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
![]() |
Ohmite | HEATSINK D2PAK TO... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat |