- Hersteller：
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- CUI Devices (2)
- Material：
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- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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7 Aufzeichnungen
| Bild | Teil | Hersteller | Beschreibung | MOQ | Aktie | Aktion | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
TE Connectivity AMP Connectors | 2 FINS,2.000 OD HS W/... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
TE Connectivity AMP Connectors | 2 FINS,2.000 OD HS W/... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
TE Connectivity AMP Connectors | 2 FINS,2.000 OD HS W/... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CTS Thermal Management Products | HEATSINK FORGED ... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
TE Connectivity AMP Connectors | 32.5MM HS ASSY ULTE |
1 |
50,000
In-stock
|
Erhalten Sie Zitat |
