- Hersteller：
-
- Würth Elektronik (8)
- Bergquist (4)
- CUI Devices (13)
- Jones Tech (1)
- Leader Tech Inc. (6)
- Parker Chomerics (2)
- t-Global Technology (134)
- Wakefield-Vette (1)
- Product Status：
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- Material：
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- Type：
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- Thickness：
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- Usage：
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- Adhesive：
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- Outline：
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- Backing, Carrier：
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- Thermal Resistivity：
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268 Aufzeichnungen
| Bild | Teil | Hersteller | Beschreibung | MOQ | Aktie | Aktion | |
|---|---|---|---|---|---|---|---|
|
t-Global Technology | THERM PAD 100MMX100... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
t-Global Technology | THERM PAD 100MMX100... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
Laird Technologies - Thermal Materials | GAP FILLER TPLI 2... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | THERMAL INTERFAC... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
t-Global Technology | THERM PAD 100MMX100... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
Leader Tech Inc. | THERM PAD 199.9MMX1... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
t-Global Technology | THERM PAD 100MMX100... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | THERMAL INTERFAC... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | SF60 THER INTERFA... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | THERMAL INTERFAC... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | THERMAL INTERFAC... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | THERMAL INTERFAC... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | THERMAL INTERFAC... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
Leader Tech Inc. | THERM PAD 199.9MMX1... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | THERMAL INTERFAC... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat |
