STM32WB55RGV6

Herst.Teilenummer
STM32WB55RGV6
Hersteller
STMicroelectronics
Paket/Fall
-
Datenblatt
Download
Beschreibung
ULTRA-LOW-POWER DUAL CORE ARM CO
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Hersteller :
STMicroelectronics
Produktkategorie :
HF-Transceiver-ICs
Current - Receiving :
3.8mA ~ 7mA
Current - Transmitting :
8.1mA ~ 13.1mA
Data Rate (Max) :
2Mbps
Frequency :
2.405GHz ~ 2.48GHz
GPIO :
49
Memory Size :
1MB Flash, 256kB SRAM
Modulation :
GFSK
Mounting Type :
Surface Mount
Operating Temperature :
-40°C ~ 85°C (TA)
Package / Case :
68-VFQFN Exposed Pad
Power - Output :
6dBm
Product Status :
Active
Protocol :
Bluetooth v5.2, Thread, Zigbee®
RF Family/Standard :
802.15.4, Bluetooth
Sensitivity :
-100dBm
Serial Interfaces :
ADC, I²C, SPI, UART, USART, USB
Supplier Device Package :
68-VFQFPN (8x8)
Type :
TxRx + MCU
Voltage - Supply :
1.71V ~ 3.6V
Datenblätter
STM32WB55RGV6

Herstellerbezogene Produkte

  • STMicroelectronics
    MICROPHONE
  • STMicroelectronics
    AUTO & INDUSTRIAL SENSORS
  • STMicroelectronics
    MICROPHONE MEMS DIGITAL PDM OMNI
  • STMicroelectronics
    MICROPHONE MEMS DIGITAL PDM OMNI
  • STMicroelectronics
    MICROPHONE MEMS DIGITAL PDM OMNI

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