67SLG100150100PI00

Hersteller :

Laird Technologies EMI

Produktkategorie :

RFI und EMI – Kontakte, Fingerstock und Dichtungen

Attachment Method :

Solder

Height :

0.591" (15.00mm)

Length :

0.394" (10.00mm)

Material :

Polyurethane Foam, Tin-Copper Polyester (SN/CU)

Operating Temperature :

-40°C ~ 70°C

Plating :

-

Plating - Thickness :

-

Product Status :

Active

Shape :

Rectangle

Type :

Film Over Foam

Width :

0.394" (10.00mm)