FI-XB30SSLA-HF15

Herst.Teilenummer
FI-XB30SSLA-HF15
Hersteller
JAE Electronics
Paket/Fall
-
Datenblatt
Download
Beschreibung
CONN RCPT 30P 0.039 GOLD SMD R/A
Aktie:
Auf Lager

Fordern Sie ein Angebot an (RFQ)

* Email:
* Teilname:
* Menge (Stück):
* Captcha:
loading...
Hersteller :
JAE Electronics
Produktkategorie :
Rechteckige Steckverbinder - Stiftleisten, Buchsen, Buchsen
Connector Type :
Receptacle
Contact Finish - Mating :
Gold
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
3.90µin (0.099µm)
Contact Length - Post :
-
Contact Type :
Non-Gendered
Current Rating (Amps) :
1A per Contact
Fastening Type :
Friction Lock
Features :
Grounding Pins, Shielded, Solder Retention
Ingress Protection :
-
Insulation Color :
Beige
Insulation Height :
-
Mated Stacking Heights :
-
Material Flammability Rating :
UL94 V-0
Mounting Type :
Board Cutout, Bottom Mount, Surface Mount, Right Angle
Number of Positions :
30
Number of Positions Loaded :
All
Number of Rows :
1
Operating Temperature :
-40°C ~ 80°C
Pitch - Mating :
0.039" (1.00mm)
Product Status :
Active
Row Spacing - Mating :
-
Style :
Board to Cable/Wire
Termination :
Solder
Voltage Rating :
200V
Datenblätter
FI-XB30SSLA-HF15

Herstellerbezogene Produkte

Katalogbezogene Produkte