ED32DT

Herst.Teilenummer
ED32DT
Hersteller
On Shore Technology Inc.
Paket/Fall
-
Datenblatt
Download
Beschreibung
CONN IC DIP SOCKET 32POS TIN
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Hersteller :
On Shore Technology Inc.
Produktkategorie :
Sockel für ICs, Transistoren
Contact Finish - Mating :
Tin
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
60.0µin (1.52µm)
Contact Finish Thickness - Post :
60.0µin (1.52µm)
Contact Material - Mating :
Phosphor Bronze
Contact Material - Post :
Phosphor Bronze
Features :
Open Frame
Housing Material :
Polybutylene Terephthalate (PBT), Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
32 (2 x 16)
Operating Temperature :
-55°C ~ 110°C
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Product Status :
Active
Termination :
Solder
Type :
DIP, 0.6" (15.24mm) Row Spacing
Datenblätter
ED32DT

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