28-6554-10
- Herst.Teilenummer
- 28-6554-10
- Hersteller
- Aries Electronics
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- CONN IC DIP SOCKET ZIF 28POS TIN
- Aktie:
- Auf Lager
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- Hersteller :
- Aries Electronics
- Produktkategorie :
- Sockel für ICs, Transistoren
- Contact Finish - Mating :
- Tin
- Contact Finish - Post :
- Tin
- Contact Finish Thickness - Mating :
- 200.0µin (5.08µm)
- Contact Finish Thickness - Post :
- 200.0µin (5.08µm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Beryllium Copper
- Features :
- Closed Frame
- Housing Material :
- Polyphenylene Sulfide (PPS), Glass Filled
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 28 (2 x 14)
- Operating Temperature :
- -
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Product Status :
- Active
- Termination :
- Solder
- Type :
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Datenblätter
- 28-6554-10
