AR 32-HZL/01-TT

Herst.Teilenummer
AR 32-HZL/01-TT
Hersteller
Assmann WSW Components
Paket/Fall
-
Datenblatt
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Beschreibung
CONN IC DIP SOCKET 32POS GOLD
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Hersteller :
Assmann WSW Components
Produktkategorie :
Sockel für ICs, Transistoren
Contact Finish - Mating :
Gold
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
10.0µin (0.25µm)
Contact Finish Thickness - Post :
200.0µin (5.08µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Beryllium Copper
Features :
Open Frame
Housing Material :
Thermoplastic, Polyester
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
32 (2 x 16)
Operating Temperature :
-40°C ~ 105°C
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Product Status :
Active
Termination :
Solder
Type :
DIP, 0.6" (15.24mm) Row Spacing
Datenblätter
AR 32-HZL/01-TT

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