BU080Z-178-HT

Herst.Teilenummer
BU080Z-178-HT
Hersteller
On Shore Technology Inc.
Paket/Fall
-
Datenblatt
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Beschreibung
CONN IC DIP SOCKET 8POS GOLD
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Hersteller :
On Shore Technology Inc.
Produktkategorie :
Sockel für ICs, Transistoren
Contact Finish - Mating :
Gold
Contact Finish - Post :
Copper
Contact Finish Thickness - Mating :
78.7µin (2.00µm)
Contact Finish Thickness - Post :
Flash
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass
Features :
Open Frame
Housing Material :
Polybutylene Terephthalate (PBT), Glass Filled
Mounting Type :
Surface Mount
Number of Positions or Pins (Grid) :
8 (2 x 4)
Operating Temperature :
-55°C ~ 125°C
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Product Status :
Obsolete
Termination :
Solder
Type :
DIP, 0.3" (7.62mm) Row Spacing
Datenblätter
BU080Z-178-HT

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