822-AG11D-ESL-LF

Herst.Teilenummer
822-AG11D-ESL-LF
Hersteller
TE Connectivity AMP Connectors
Paket/Fall
-
Datenblatt
Download
Beschreibung
CONN IC DIP SOCKET 22POS GOLD
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Hersteller :
TE Connectivity AMP Connectors
Produktkategorie :
Sockel für ICs, Transistoren
Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
Flash
Contact Finish Thickness - Post :
Flash
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Copper
Features :
Open Frame
Housing Material :
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
22 (2 x 11)
Operating Temperature :
-55°C ~ 105°C
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Product Status :
Obsolete
Termination :
Solder
Type :
DIP, 0.4" (10.16mm) Row Spacing
Datenblätter
822-AG11D-ESL-LF

Herstellerbezogene Produkte

  • TE Connectivity AMP Connectors
    CONN PLUG HOUSING CPC 6POS BLACK
  • TE Connectivity AMP Connectors
    CONN RECEPT HOUSING CPC 6POS BLK
  • TE Connectivity AMP Connectors
    CONN PLUG HOUSING CPC 4POS BLACK
  • TE Connectivity AMP Connectors
    CONN HOUSING PIN CPC 5POS BLACK
  • TE Connectivity AMP Connectors
    CONN HOUSING SOCKET CPC 5POS BLK

Katalogbezogene Produkte

  • Assmann WSW Components
    CONN IC DIP SOCKET 14POS TIN
  • TE Connectivity AMP Connectors
    CONN IC DIP SOCKET 16POS TIN
  • Assmann WSW Components
    CONN IC DIP SOCKET 16POS TIN
  • Adam Tech
    IC SOCKET, DIP, 28P 2.54MM PITCH
  • Assmann WSW Components
    CONN IC DIP SOCKET 16POS TIN