D8864-42

Hersteller :

Harwin Inc.

Produktkategorie :

Sockel für ICs, Transistoren

Contact Finish - Mating :

Gold

Contact Finish - Post :

Tin

Contact Finish Thickness - Mating :

Flash

Contact Finish Thickness - Post :

196.9µin (5.00µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Brass

Features :

Open Frame

Housing Material :

Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

64 (2 x 32)

Operating Temperature :

-55°C ~ 125°C

Pitch - Mating :

0.070" (1.78mm)

Pitch - Post :

0.070" (1.78mm)

Product Status :

Active

Termination :

Solder

Type :

DIP, 0.75" (19.05mm) Row Spacing