04-1518-00

Hersteller :

Aries Electronics

Produktkategorie :

Sockel für ICs, Transistoren

Contact Finish - Mating :

Gold

Contact Finish - Post :

Tin

Contact Finish Thickness - Mating :

10.0µin (0.25µm)

Contact Finish Thickness - Post :

200.0µin (5.08µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Brass

Features :

Open Frame

Housing Material :

Polyamide (PA46), Nylon 4/6, Glass Filled

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

4 (2 x 2)

Operating Temperature :

-

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Product Status :

Active

Termination :

Solder

Type :

DIP, 0.2" (5.08mm) Row Spacing