8114LB603G

Herst.Teilenummer
8114LB603G
Hersteller
Aavid, Thermal Division of Boyd Corporation
Paket/Fall
-
Datenblatt
Download
Beschreibung
HEATSINK
Aktie:
Auf Lager

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Hersteller :
Aavid, Thermal Division of Boyd Corporation
Produktkategorie :
Sockel für ICs, Transistoren
Contact Finish - Mating :
-
Contact Finish - Post :
-
Contact Finish Thickness - Mating :
-
Contact Finish Thickness - Post :
-
Contact Material - Mating :
-
Contact Material - Post :
-
Features :
-
Housing Material :
-
Mounting Type :
-
Number of Positions or Pins (Grid) :
-
Operating Temperature :
-
Pitch - Mating :
-
Pitch - Post :
-
Product Status :
Active
Termination :
-
Type :
-
Datenblätter
8114LB603G

Herstellerbezogene Produkte

  • Aavid, Thermal Division of Boyd Corporation
    HEATSINK
  • Aavid, Thermal Division of Boyd Corporation
    CARD GUIDE EJECTOR PULLER
  • Aavid, Thermal Division of Boyd Corporation
    CARD GUIDE EJECTOR PULLER
  • Aavid, Thermal Division of Boyd Corporation
    CARD GUIDE EJECTOR PULLER
  • Aavid, Thermal Division of Boyd Corporation
    CARD GUIDE EJECTOR PULLER

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    CONN IC DIP SOCKET 16POS TIN
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    IC SOCKET, DIP, 28P 2.54MM PITCH
  • Assmann WSW Components
    CONN IC DIP SOCKET 16POS TIN