08-810-90C

Hersteller :

Aries Electronics

Produktkategorie :

Sockel für ICs, Transistoren

Contact Finish - Mating :

Gold

Contact Finish - Post :

Tin

Contact Finish Thickness - Mating :

30.0µin (0.76µm)

Contact Finish Thickness - Post :

200.0µin (5.08µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Brass

Features :

Closed Frame

Housing Material :

Polyamide (PA46), Nylon 4/6, Glass Filled

Mounting Type :

Through Hole, Right Angle, Vertical

Number of Positions or Pins (Grid) :

8 (2 x 4)

Operating Temperature :

-

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Product Status :

Active

Termination :

Solder

Type :

DIP, 0.3" (7.62mm) Row Spacing