115-91-422-41-003000

Hersteller :

Mill-Max Manufacturing Corp.

Produktkategorie :

Sockel für ICs, Transistoren

Contact Finish - Mating :

Gold

Contact Finish - Post :

Tin-Lead

Contact Finish Thickness - Mating :

10.0µin (0.25µm)

Contact Finish Thickness - Post :

200.0µin (5.08µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Brass Alloy

Features :

Open Frame

Housing Material :

Thermoplastic

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

22 (2 x 11)

Operating Temperature :

-55°C ~ 125°C

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Product Status :

Active

Termination :

Solder

Type :

DIP, 0.4" (10.16mm) Row Spacing