BU280Z-178-HT

Hersteller :

On Shore Technology Inc.

Produktkategorie :

Sockel für ICs, Transistoren

Contact Finish - Mating :

Gold

Contact Finish - Post :

Copper

Contact Finish Thickness - Mating :

78.7µin (2.00µm)

Contact Finish Thickness - Post :

Flash

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Brass

Features :

Open Frame

Housing Material :

Polybutylene Terephthalate (PBT), Glass Filled

Mounting Type :

Surface Mount

Number of Positions or Pins (Grid) :

28 (2 x 14)

Operating Temperature :

-55°C ~ 125°C

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Product Status :

Active

Termination :

Solder

Type :

DIP, 0.6" (15.24mm) Row Spacing