2350616-1

Herst.Teilenummer
2350616-1
Hersteller
TE Connectivity AMP Connectors
Paket/Fall
-
Datenblatt
Download
Beschreibung
DUAL LGA,250 POS, DMD SOCKET
Aktie:
Auf Lager

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Hersteller :
TE Connectivity AMP Connectors
Produktkategorie :
Sockel für ICs, Transistoren
Contact Finish - Mating :
Gold
Contact Finish - Post :
-
Contact Finish Thickness - Mating :
3.00µin (0.076µm)
Contact Finish Thickness - Post :
-
Contact Material - Mating :
Copper Alloy
Contact Material - Post :
-
Features :
Board Guide, Open Frame
Housing Material :
Thermoplastic
Mounting Type :
Surface Mount
Number of Positions or Pins (Grid) :
250 (16 x 25)
Operating Temperature :
-25°C ~ 100°C
Pitch - Mating :
0.039" (1.00mm)
Pitch - Post :
-
Product Status :
Active
Termination :
Solder
Type :
LGA
Datenblätter
2350616-1

Herstellerbezogene Produkte

  • TE Connectivity AMP Connectors
    CONN PLUG HOUSING CPC 6POS BLACK
  • TE Connectivity AMP Connectors
    CONN RECEPT HOUSING CPC 6POS BLK
  • TE Connectivity AMP Connectors
    CONN PLUG HOUSING CPC 4POS BLACK
  • TE Connectivity AMP Connectors
    CONN HOUSING PIN CPC 5POS BLACK
  • TE Connectivity AMP Connectors
    CONN HOUSING SOCKET CPC 5POS BLK

Katalogbezogene Produkte

  • Assmann WSW Components
    CONN IC DIP SOCKET 14POS TIN
  • TE Connectivity AMP Connectors
    CONN IC DIP SOCKET 16POS TIN
  • Assmann WSW Components
    CONN IC DIP SOCKET 16POS TIN
  • Adam Tech
    IC SOCKET, DIP, 28P 2.54MM PITCH
  • Assmann WSW Components
    CONN IC DIP SOCKET 16POS TIN