XR2T-1621-N

Herst.Teilenummer
XR2T-1621-N
Hersteller
Omron Electronics Inc-EMC Div
Paket/Fall
-
Datenblatt
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Beschreibung
CONN IC DIP SOCKET 16POS GOLD
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Hersteller :
Omron Electronics Inc-EMC Div
Produktkategorie :
Sockel für ICs, Transistoren
Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
Flash
Contact Finish Thickness - Post :
Flash
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Beryllium Copper
Features :
Open Frame, Seal Tape
Housing Material :
Polybutylene Terephthalate (PBT), Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
16 (2 x 8)
Operating Temperature :
-55°C ~ 125°C
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Product Status :
Active
Termination :
Solder
Type :
DIP, 0.3" (7.62mm) Row Spacing
Datenblätter
XR2T-1621-N

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