2287402-1

Herst.Teilenummer
2287402-1
Hersteller
WEC
Paket/Fall
-
Datenblatt
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Beschreibung
CONN SOCKET LGA 1151POS GOLD
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Hersteller :
WEC
Produktkategorie :
Sockel für ICs, Transistoren
Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
15.0µin (0.38µm)
Contact Finish Thickness - Post :
15.0µin (0.38µm)
Contact Material - Mating :
Copper Alloy
Contact Material - Post :
Copper Alloy
Features :
Closed Frame
Housing Material :
Thermoplastic
Mounting Type :
Surface Mount
Number of Positions or Pins (Grid) :
1151
Operating Temperature :
-
Pitch - Mating :
0.036" (0.91mm)
Pitch - Post :
0.036" (0.91mm)
Product Status :
Last Time Buy
Termination :
Solder
Type :
LGA
Datenblätter
2287402-1

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