24-6554-18

Hersteller :

Aries Electronics

Produktkategorie :

Sockel für ICs, Transistoren

Contact Finish - Mating :

Nickel Boron

Contact Finish - Post :

Nickel Boron

Contact Finish Thickness - Mating :

50.0µin (1.27µm)

Contact Finish Thickness - Post :

50.0µin (1.27µm)

Contact Material - Mating :

Beryllium Nickel

Contact Material - Post :

Beryllium Nickel

Features :

Closed Frame

Housing Material :

Polyetheretherketone (PEEK), Glass Filled

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

24 (2 x 12)

Operating Temperature :

-55°C ~ 250°C

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Product Status :

Active

Termination :

Solder

Type :

DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing