510-13-281-19-081001

Hersteller :

Mill-Max Manufacturing Corp.

Produktkategorie :

Sockel für ICs, Transistoren

Contact Finish - Mating :

Gold

Contact Finish - Post :

Gold

Contact Finish Thickness - Mating :

30.0µin (0.76µm)

Contact Finish Thickness - Post :

10.0µin (0.25µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Brass Alloy

Features :

Open Frame

Housing Material :

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

281 (19 x 19)

Operating Temperature :

-55°C ~ 125°C

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Product Status :

Active

Termination :

Solder

Type :

PGA