1-1981837-2

Herst.Teilenummer
1-1981837-2
Hersteller
TE Connectivity AMP Connectors
Paket/Fall
-
Datenblatt
Download
Beschreibung
CONN SOCKET LGA 1366POS GOLD
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Auf Lager

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Hersteller :
TE Connectivity AMP Connectors
Produktkategorie :
Sockel für ICs, Transistoren
Contact Finish - Mating :
Gold
Contact Finish - Post :
-
Contact Finish Thickness - Mating :
30.0µin (0.76µm)
Contact Finish Thickness - Post :
-
Contact Material - Mating :
Copper Alloy
Contact Material - Post :
-
Features :
Open Frame
Housing Material :
Thermoplastic
Mounting Type :
Surface Mount
Number of Positions or Pins (Grid) :
1366 (32 x 41)
Operating Temperature :
-
Pitch - Mating :
0.040" (1.02mm)
Pitch - Post :
0.040" (1.01mm)
Product Status :
Active
Termination :
Solder
Type :
LGA
Datenblätter
1-1981837-2

Herstellerbezogene Produkte

  • TE Connectivity AMP Connectors
    CONN PLUG HOUSING CPC 6POS BLACK
  • TE Connectivity AMP Connectors
    CONN RECEPT HOUSING CPC 6POS BLK
  • TE Connectivity AMP Connectors
    CONN PLUG HOUSING CPC 4POS BLACK
  • TE Connectivity AMP Connectors
    CONN HOUSING PIN CPC 5POS BLACK
  • TE Connectivity AMP Connectors
    CONN HOUSING SOCKET CPC 5POS BLK

Katalogbezogene Produkte

  • Assmann WSW Components
    CONN IC DIP SOCKET 14POS TIN
  • TE Connectivity AMP Connectors
    CONN IC DIP SOCKET 16POS TIN
  • Assmann WSW Components
    CONN IC DIP SOCKET 16POS TIN
  • Adam Tech
    IC SOCKET, DIP, 28P 2.54MM PITCH
  • Assmann WSW Components
    CONN IC DIP SOCKET 16POS TIN