D01-9506442

Hersteller :

Harwin Inc.

Produktkategorie :

Sockel für ICs, Transistoren

Contact Finish - Mating :

Gold

Contact Finish - Post :

Tin

Contact Finish Thickness - Mating :

30.0µin (0.76µm)

Contact Finish Thickness - Post :

-

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Brass

Features :

Elevated

Housing Material :

Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

46 (1 x 46)

Operating Temperature :

-55°C ~ 125°C

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Product Status :

Obsolete

Termination :

Solder

Type :

SIP