XR2E-3201-N

Hersteller :

Omron Electronics Inc-EMC Div

Produktkategorie :

Sockel für ICs, Transistoren

Contact Finish - Mating :

Gold

Contact Finish - Post :

Gold

Contact Finish Thickness - Mating :

29.5µin (0.75µm)

Contact Finish Thickness - Post :

29.5µin (0.75µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Beryllium Copper

Features :

Carrier

Housing Material :

Polybutylene Terephthalate (PBT), Glass Filled

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

32 (1 x 32)

Operating Temperature :

-55°C ~ 125°C

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Product Status :

Obsolete

Termination :

Solder

Type :

SIP