- Hersteller :
- 3M
- Produktkategorie :
- Sockel für ICs, Transistoren
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- 30.0µin (0.76µm)
- Contact Finish Thickness - Post :
- 30.0µin (0.76µm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Beryllium Copper
- Features :
- Closed Frame
- Housing Material :
- Polyphenylene Sulfide (PPS), Glass Filled
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 68 (4 x 17)
- Operating Temperature :
- -55°C ~ 105°C
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Product Status :
- Discontinued at Digi-Key
- Termination :
- Solder
- Type :
- CLCC
- Datenblätter
- 268-5401-11-1102JH
