508-AG10D-ESL
- Herst.Teilenummer
- 508-AG10D-ESL
- Hersteller
- TE Connectivity AMP Connectors
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- CONN IC DIP SOCKET 8POS GOLD
- Aktie:
- Auf Lager
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- Hersteller :
- TE Connectivity AMP Connectors
- Produktkategorie :
- Sockel für ICs, Transistoren
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- 5.00µin (0.127µm)
- Contact Finish Thickness - Post :
- 5.00µin (0.127µm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Brass
- Features :
- Closed Frame
- Housing Material :
- -
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 8 (2 x 4)
- Operating Temperature :
- -55°C ~ 125°C
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Product Status :
- Obsolete
- Termination :
- Solder
- Type :
- DIP, 0.3" (7.62mm) Row Spacing
- Datenblätter
- 508-AG10D-ESL
