- Hersteller :
- WEC
- Produktkategorie :
- Speicheranschlüsse – Inline-Modulsockel
- Connector Style :
- SIMM
- Contact Finish :
- Tin
- Contact Finish Thickness :
- 200.0µin (5.08µm)
- Features :
- Board Guide, Latches
- Memory Type :
- RAM
- Mounting Feature :
- -
- Mounting Type :
- Through Hole
- Number of Positions :
- 80
- Product Status :
- Active
- Standards :
- MO-116
- Datenblätter
- 5822021-5