ATSAMHA0G17A-MZT-BVAO

Herst.Teilenummer
ATSAMHA0G17A-MZT-BVAO
Hersteller
Microchip Technology
Paket/Fall
-
Datenblatt
Download
Beschreibung
LIN SYSTEM IN PACKAGE SIP (MCU +
Aktie:
Auf Lager

Fordern Sie ein Angebot an (RFQ)

* Email:
* Teilname:
* Menge (Stück):
* Captcha:
loading...
Hersteller :
Microchip Technology
Produktkategorie :
Eingebettet - Mikrocontroller
Connectivity :
I²C, LINbus SBC, SPI, UART/USART
Core Processor :
ARM® Cortex®-M0+
Core Size :
32-Bit Single-Core
Data Converters :
A/D 13x12b; D/A 1x10b
EEPROM Size :
-
Mounting Type :
Surface Mount, Wettable Flank
Number of I/O :
32
Operating Temperature :
-40°C ~ 115°C (TC)
Oscillator Type :
External, Internal
Package / Case :
48-VFQFN Exposed Pad
Peripherals :
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Product Status :
Active
Program Memory Size :
128KB (128K x 8)
Program Memory Type :
Flash
RAM Size :
16K x 8
Speed :
48MHz
Supplier Device Package :
48-VQFN (7x7)
Voltage - Supply (Vcc/Vdd) :
5V ~ 28V
Datenblätter
ATSAMHA0G17A-MZT-BVAO

Herstellerbezogene Produkte

  • Microchip Technology
    SI CAPACITOR NON HERMETIC CHIP
  • Microchip Technology
    SI CAPACITOR NON HERMETIC CHIP
  • Microchip Technology
    SI CAPACITOR NON HERMETIC CHIP
  • Microchip Technology
    SI CAPACITOR NON HERMETIC CHIP
  • Microchip Technology
    SI CAPACITOR NON HERMETIC CHIP

Katalogbezogene Produkte