BU8874F-E2

Herst.Teilenummer
BU8874F-E2
Hersteller
Rohm Semiconductor
Paket/Fall
-
Datenblatt
Download
Beschreibung
IC TELECOM INTERFACE 18SOP
Aktie:
Auf Lager

Fordern Sie ein Angebot an (RFQ)

* Email:
* Teilname:
* Menge (Stück):
* Captcha:
loading...
Hersteller :
Rohm Semiconductor
Produktkategorie :
Schnittstelle - Telekom
Current - Supply :
2.2mA
Function :
Receiver, DTMF
Interface :
-
Mounting Type :
Surface Mount
Number of Circuits :
1
Operating Temperature :
-10°C ~ 70°C
Package / Case :
18-SOIC (0.213", 5.40mm Width)
Power (Watts) :
550 mW
Product Status :
Obsolete
Supplier Device Package :
18-SOP
Voltage - Supply :
4.75V ~ 5.25V
Datenblätter
BU8874F-E2

Herstellerbezogene Produkte

Katalogbezogene Produkte

  • Rochester Electronics, LLC
    DUSLIC: TWIN SUBSCRIBER LINE INT
  • Rochester Electronics, LLC
    SLIC, 2-4 CONVERSION, BIPOLAR
  • Rochester Electronics, LLC
    INFINEON PMB8761V3.14 TELECOM IC
  • Rochester Electronics, LLC
    INFINEON PMB8753AV TELECOM IC -
  • Rochester Electronics, LLC
    TELECOM CIRCUIT, 1-FUNC, BIMOS