573400D00000G

Herst.Teilenummer
573400D00000G
Hersteller
Aavid, Thermal Division of Boyd Corporation
Paket/Fall
-
Datenblatt
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Beschreibung
BOARD LEVEL HEAT SINK
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Hersteller :
Aavid, Thermal Division of Boyd Corporation
Produktkategorie :
Thermal - Kühlkörper
Attachment Method :
SMD Pad
Diameter :
-
Fin Height :
0.401" (10.20mm)
Length :
0.500" (12.70mm)
Material :
-
Material Finish :
Tin
Package Cooled :
TO-268 (D³Pak)
Power Dissipation @ Temperature Rise :
1.0W @ 20°C
Product Status :
Active
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
4.00°C/W @ 600 LFM
Thermal Resistance @ Natural :
14.00°C/W
Type :
Top Mount
Width :
1.220" (30.99mm)
Datenblätter
573400D00000G

Herstellerbezogene Produkte

  • Aavid, Thermal Division of Boyd Corporation
    HEATSINK
  • Aavid, Thermal Division of Boyd Corporation
    CARD GUIDE EJECTOR PULLER
  • Aavid, Thermal Division of Boyd Corporation
    CARD GUIDE EJECTOR PULLER
  • Aavid, Thermal Division of Boyd Corporation
    CARD GUIDE EJECTOR PULLER
  • Aavid, Thermal Division of Boyd Corporation
    CARD GUIDE EJECTOR PULLER

Katalogbezogene Produkte

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