110991329

Herst.Teilenummer
110991329
Hersteller
Seeed Technology Co., Ltd
Paket/Fall
-
Datenblatt
Download
Beschreibung
HEAT SINK KIT FOR RASPBERRY PI 4
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Hersteller :
Seeed Technology Co., Ltd
Produktkategorie :
Thermal - Kühlkörper
Attachment Method :
Adhesive
Diameter :
-
Fin Height :
-
Length :
-
Material :
Aluminum, Copper
Material Finish :
-
Package Cooled :
Raspberry Pi 4B
Power Dissipation @ Temperature Rise :
-
Product Status :
Active
Shape :
-
Thermal Resistance @ Forced Air Flow :
-
Thermal Resistance @ Natural :
-
Type :
Top Mount Kit
Width :
-
Datenblätter
110991329

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