374324B00035G

Herst.Teilenummer
374324B00035G
Hersteller
Aavid, Thermal Division of Boyd Corporation
Paket/Fall
-
Datenblatt
Download
Beschreibung
HEATSINK BGA W/ADHESIVE TAPE
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Auf Lager

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Hersteller :
Aavid, Thermal Division of Boyd Corporation
Produktkategorie :
Thermal - Kühlkörper
Attachment Method :
Thermal Tape, Adhesive (Included)
Diameter :
-
Fin Height :
0.394" (10.00mm)
Length :
1.063" (27.00mm)
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
BGA, FPGA
Power Dissipation @ Temperature Rise :
3.0W @ 90°C
Product Status :
Active
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
9.30°C/W @ 200 LFM
Thermal Resistance @ Natural :
30.60°C/W
Type :
Board Level
Width :
1.063" (27.00mm)
Datenblätter
374324B00035G

Herstellerbezogene Produkte

  • Aavid, Thermal Division of Boyd Corporation
    HEATSINK
  • Aavid, Thermal Division of Boyd Corporation
    CARD GUIDE EJECTOR PULLER
  • Aavid, Thermal Division of Boyd Corporation
    CARD GUIDE EJECTOR PULLER
  • Aavid, Thermal Division of Boyd Corporation
    CARD GUIDE EJECTOR PULLER
  • Aavid, Thermal Division of Boyd Corporation
    CARD GUIDE EJECTOR PULLER

Katalogbezogene Produkte