BDN14-3CB/A01

Herst.Teilenummer
BDN14-3CB/A01
Hersteller
CTS Thermal Management Products
Paket/Fall
-
Datenblatt
Download
Beschreibung
HEATSINK CPU W/ADHESIVE 1.41"SQ
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Hersteller :
CTS Thermal Management Products
Produktkategorie :
Thermal - Kühlkörper
Attachment Method :
Thermal Tape, Adhesive (Included)
Diameter :
-
Fin Height :
0.355" (9.02mm)
Length :
1.410" (35.81mm)
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise :
-
Product Status :
Active
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
5.60°C/W @ 400 LFM
Thermal Resistance @ Natural :
16.20°C/W
Type :
Top Mount
Width :
1.410" (35.81mm)
Datenblätter
BDN14-3CB/A01

Herstellerbezogene Produkte

  • CTS Thermal Management Products
    PCB RETAINER 4.5" HEX-HEAD ROD
  • CTS Thermal Management Products
    PCB RETAINER 4.5" HEX-HEAD ROD
  • CTS Thermal Management Products
    PCB RETAINER 5.25" HEX-HEAD ROD
  • CTS Thermal Management Products
    PCB RETAINER 5.25" HEX-HEAD ROD
  • CTS Thermal Management Products
    PCB ZIF RETAINER .026"

Katalogbezogene Produkte