APF30-30-10CB
- Herst.Teilenummer
- APF30-30-10CB
- Hersteller
- CTS Thermal Management Products
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- HEATSINK LOW-PROFILE FORGED
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- Hersteller :
- CTS Thermal Management Products
- Produktkategorie :
- Thermal - Kühlkörper
- Attachment Method :
- Thermal Tape, Adhesive (Not Included)
- Diameter :
- -
- Fin Height :
- 0.370" (9.40mm)
- Length :
- 1.181" (30.00mm)
- Material :
- Aluminum
- Material Finish :
- Black Anodized
- Package Cooled :
- Assorted (BGA, LGA, CPU, ASIC...)
- Power Dissipation @ Temperature Rise :
- -
- Product Status :
- Active
- Shape :
- Square, Fins
- Thermal Resistance @ Forced Air Flow :
- 3.30°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- -
- Type :
- Top Mount
- Width :
- 1.181" (30.00mm)
- Datenblätter
- APF30-30-10CB