V-1102-SMD/A-L

Herst.Teilenummer
V-1102-SMD/A-L
Hersteller
Assmann WSW Components
Paket/Fall
-
Datenblatt
Download
Beschreibung
HEATSINK TO-263 19.38X25.40MM
Aktie:
Auf Lager

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Hersteller :
Assmann WSW Components
Produktkategorie :
Thermal - Kühlkörper
Attachment Method :
SMD Pad
Diameter :
-
Fin Height :
0.450" (11.43mm)
Length :
0.763" (19.38mm)
Material :
Copper
Material Finish :
Tin
Package Cooled :
TO-263 (D²Pak)
Power Dissipation @ Temperature Rise :
-
Product Status :
Active
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
23.00°C/W @ 300 LFM
Thermal Resistance @ Natural :
11.00°C/W
Type :
Top Mount
Width :
1.000" (25.40mm)
Datenblätter
V-1102-SMD/A-L

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