HSS-C2540-SMT-TR
- Herst.Teilenummer
- HSS-C2540-SMT-TR
- Hersteller
- CUI Devices
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- HEAT SINK TO-263 COPPER
- Aktie:
- Auf Lager
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- Hersteller :
- CUI Devices
- Produktkategorie :
- Thermal - Kühlkörper
- Attachment Method :
- -
- Diameter :
- -
- Fin Height :
- 0.450" (11.43mm)
- Length :
- 0.763" (19.38mm)
- Material :
- Copper
- Material Finish :
- Tin
- Package Cooled :
- TO-263 (D²Pak)
- Power Dissipation @ Temperature Rise :
- 3.8W @ 75°C
- Product Status :
- Active
- Shape :
- Rectangular, Fins
- Thermal Resistance @ Forced Air Flow :
- 5.50°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 21.90°C/W
- Type :
- Board Level
- Width :
- 1.000" (25.40mm)
- Datenblätter
- HSS-C2540-SMT-TR