HSET860-BGA-1

Hersteller :

iBASE Technology

Produktkategorie :

Thermal - Kühlkörper

Attachment Method :

-

Diameter :

-

Fin Height :

-

Length :

-

Material :

-

Material Finish :

-

Package Cooled :

ET860

Power Dissipation @ Temperature Rise :

-

Product Status :

Active

Shape :

-

Thermal Resistance @ Forced Air Flow :

-

Thermal Resistance @ Natural :

-

Type :

Top Mount

Width :

-