HSB01-080808

Hersteller :

CUI Devices

Produktkategorie :

Thermal - Kühlkörper

Attachment Method :

Adhesive

Diameter :

-

Fin Height :

0.315" (8.00mm)

Length :

0.335" (8.50mm)

Material :

Aluminum Alloy

Material Finish :

Black Anodized

Package Cooled :

BGA

Power Dissipation @ Temperature Rise :

1.9W @ 75°C

Product Status :

Active

Shape :

Square, Pin Fins

Thermal Resistance @ Forced Air Flow :

16.00°C/W @ 200 LFM

Thermal Resistance @ Natural :

39.10°C/W

Type :

Top Mount

Width :

0.335" (8.50mm)