HSS-C52-NP-SMT-TR

Hersteller :

CUI Devices

Produktkategorie :

Thermal - Kühlkörper

Attachment Method :

-

Diameter :

-

Fin Height :

0.400" (10.16mm)

Length :

0.315" (8.00mm)

Material :

Copper

Material Finish :

Tin

Package Cooled :

TO-252 (DPAK)

Power Dissipation @ Temperature Rise :

2.1W @ 75°C

Product Status :

Active

Shape :

Rectangular, Fins

Thermal Resistance @ Forced Air Flow :

10.05°C/W @ 200 LFM

Thermal Resistance @ Natural :

35.71°C/W

Type :

Top Mount

Width :

0.900" (22.86mm)