HSS-C2591-SMT-TR
- Herst.Teilenummer
- HSS-C2591-SMT-TR
- Hersteller
- CUI Devices
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- HEAT SINK TO-263 COPPER
- Aktie:
- Auf Lager
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- Hersteller :
- CUI Devices
- Produktkategorie :
- Thermal - Kühlkörper
- Attachment Method :
- -
- Diameter :
- -
- Fin Height :
- 0.375" (9.52mm)
- Length :
- 0.591" (15.00mm)
- Material :
- Copper
- Material Finish :
- Tin
- Package Cooled :
- TO-263 (D²Pak)
- Power Dissipation @ Temperature Rise :
- 2.1W @ 75°C
- Product Status :
- Active
- Shape :
- Rectangular, Fins
- Thermal Resistance @ Forced Air Flow :
- 8.15°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 35.71°C/W
- Type :
- Top Mount
- Width :
- 1.020" (25.91mm)
- Datenblätter
- HSS-C2591-SMT-TR