NC4SW.020 1LB

Hersteller :

Chip Quik Inc.

Produktkategorie :

Lot

Composition :

Pb93.5Sn5Ag1.5 (93.5/5/1.5)

Diameter :

0.020" (0.51mm)

Flux Type :

No-Clean

Form :

Spool, 1 lb (454 g)

Melting Point :

565 ~ 574°F (296 ~ 301°C)

Mesh Type :

-

Process :

Leaded

Product Status :

Active

Shelf Life :

-

Shelf Life Start :

-

Storage/Refrigeration Temperature :

-

Type :

Wire Solder

Wire Gauge :

24 AWG, 25 SWG