WS991AX500T4
- Herst.Teilenummer
- WS991AX500T4
- Hersteller
- Chip Quik Inc.
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- SOLDER PASTE THERMALLY STABLE WS
- Aktie:
- Auf Lager
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- Hersteller :
- Chip Quik Inc.
- Produktkategorie :
- Lot
- Composition :
- Sn63Pb37 (63/37)
- Diameter :
- -
- Flux Type :
- Water Soluble
- Form :
- Jar, 17.64 oz (500g)
- Melting Point :
- 361°F (183°C)
- Mesh Type :
- 4
- Process :
- Leaded
- Product Status :
- Active
- Shelf Life :
- 6 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- -
- Type :
- Solder Paste
- Wire Gauge :
- -
- Datenblätter
- WS991AX500T4
