4900P-250G

Herst.Teilenummer
4900P-250G
Hersteller
MG Chemicals
Paket/Fall
-
Datenblatt
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Beschreibung
LEADED NO CLEAN SOLDER PASTE
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Auf Lager

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Hersteller :
MG Chemicals
Produktkategorie :
Lot
Composition :
Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4)
Diameter :
-
Flux Type :
No-Clean
Form :
Jar, 8.8 oz (250g)
Melting Point :
423 ~ 430°F (217 ~ 221°C)
Mesh Type :
-
Process :
Lead Free
Product Status :
Active
Shelf Life :
24 Months
Shelf Life Start :
Date of Manufacture
Storage/Refrigeration Temperature :
35°F ~ 50°F (2°C ~ 10°C)
Type :
Solder Paste
Wire Gauge :
-
Datenblätter
4900P-250G

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